BGA – Matthew Petroff https://mpetroff.net mpetroff.net Fri, 31 Mar 2017 23:32:58 +0000 en-US hourly 1 Soldering OSD3358 System-in-Package https://mpetroff.net/2017/03/soldering-osd3358-system-in-package/ https://mpetroff.net/2017/03/soldering-osd3358-system-in-package/#respond Fri, 31 Mar 2017 23:32:58 +0000 https://mpetroff.net/?p=2430 Continue reading →]]> Although the OSD3358 system-in-package, the so-called BeagleBone on a Chip, is a BGA package, it turns out that it’s surprisingly easy to solder. Using a stencil, solder paste, and a hot plate, it ended up being easier to solder than some QFN and fine pitch leaded packages I’ve soldered via the same method, since the OSD3358’s ball pitch is wider and the PCB pads have solder resist between them.

OSD3358
OSD3358

Unfortunately, I didn’t take any photos while soldering them.

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