Soldering OSD3358 System-in-Package

Although the OSD3358 system-in-package, the so-called BeagleBone on a Chip, is a BGA package, it turns out that it’s surprisingly easy to solder. Using a stencil, solder paste, and a hot plate, it ended up being easier to solder than some QFN and fine pitch leaded packages I’ve soldered via the same method, since the OSD3358’s ball pitch is wider and the PCB pads have solder resist between them.

OSD3358
OSD3358

Unfortunately, I didn’t take any photos while soldering them.

This entry was posted in and tagged , , , , . Bookmark the permalink.

Leave a Reply

Your email address will not be published.